Topic 1: Advanced Conductive Heat Transfer. Modeling approaches for composite systems; phase change in conduction-dominant heat transfer systems; analysis of complex source terms in conduction systems; conduction physics at material interfaces; coupled thermo-mechanical response in conduction systems; and solution techniques for multidimensional, unsteady conduction phenomena.

Topic 2: Advanced Convective Heat and Mass Transfer. Fundamental study of momentum, energy, and mass transport in convective systems in laminar and turbulent regimes, and several flow configurations.

Topic 3: Radiation Heat Transfer. Thermal radiation, blackbody properties, surface properties, radiant exchange, absorbing and emitting media, combined modes.

Topic 4: Fundamentals of Heat and Mass Transfer. Fundamentals of conduction, convective heat transfer, diffusive and convective mass transfer, thermal radiative exchange.

Topic 5: Radiation in Participating Media. Methods for treating thermal radiation in absorbing, transmitting, and scattering media.

Topic 6: Multiphase Flow and Heat Transfer. Heat, mass, and momentum transfer in multi-phase flow systems: flows with particles, drops and bubbles, boiling, condensation, and absorption.

Topic 7: Nanoscale Energy Transport and Conversion. Nanoscale transport phenomena and energy conversion processes. Parallel theoretical treatment of transport and conversion processes of electrons, phonons, photons, and molecules in various applications including photovoltaic and thermoelectric energy conversions, microelectronics, nanomaterials, and laser materials processing.

Topic 8: Microelectronics Packaging and Thermal Management. Explore basics of semiconductor fabrication, microelectronics packaging techniques, thermomechanical issues in packaging, reliability-related aspects in packaging, thermal management conditions, Conduction-based cooling, air and liquid cooling, phase change-based cooling, role of packaging materials. Discuss challenges and solutions at multiple length scales, from transistors (nanometers) to data centers (10's of meters). Mechanical Engineering 397 (Topic: Microelectronics Pckg: Fndmtls) and Mechanical Engineering 381R (Topic 8) may not both be counted. Three lecture hours a week for one semester. Additional prerequisite: Graduate standing, undergraduate coursework in heat transfer or the equivalent, and consent of instructor.